| Management number | 247327397 | Release Date | 2026/08/16 | List Price | US$5.20 | Model Number | 247327397 | ||
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Description Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90.25% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 183C (361F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
| UPC | 700254127156 |
|---|---|
| ASIN | B07BH5LP5G |
| Color | silver |
| Model | SMD291AX50T3 |
| Volume | 50 ml |
| Item Form | Paste |
| Brand Name | Chip Quik |
| Unit Count | 1.76 Ounce |
| Part Number | SMD291AX50T3 |
| Manufacturer | Chip Quik® |
| Material Type | Metal |
| Container Type | Jar |
| Viscosity Level | Medium |
| Compatible Material | Metal |
| Item Package Quantity | 1 |
| Water Resistance Level | Not Water Resistant |
| Specific Uses For Product | Electronics Soldering and Repair |
| Other Special Features of the Product | High Metal Content, No Clean Required |
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