Chip Quik SMD291AX50T3 Solder Paste in jar 50g (T3) Sn63/Pb37 no clean

★★★★★ 4.6 38 reviews

US$5.20
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Product details

Management number 247327397 Release Date 2026/08/16 List Price US$5.20 Model Number 247327397
Category

Description Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90.25% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 183C (361F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

  • Chip Quik SMD291AX50T3 Solder Paste: Contains 50g of solder paste for SMD components
  • Made with Sn63/Pb37 alloy: Provides reliable electrical and thermal conductivity
  • No clean required: Saves time and effort in the soldering process
  • Compatible with most SMD components: Suitable for use in electronic devices
  • Made by Chip Quik: A trusted brand in electronics soldering and repair
UPC 700254127156
ASIN B07BH5LP5G
Color silver
Model SMD291AX50T3
Volume 50 ml
Item Form Paste
Brand Name Chip Quik
Unit Count 1.76 Ounce
Part Number SMD291AX50T3
Manufacturer Chip Quik®
Material Type Metal
Container Type Jar
Viscosity Level Medium
Compatible Material Metal
Item Package Quantity 1
Water Resistance Level Not Water Resistant
Specific Uses For Product Electronics Soldering and Repair
Other Special Features of the Product High Metal Content, No Clean Required

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4.6 out of 5
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38 ratings | 16 reviews
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